Meeting the demands of numerous industries from medical device to electronics manufacturing it may be necessary to create numerous and dense areas of highly precise and accurately placed micro-holes. Smaller diameters can make the mechanical drilling process much more difficult because of the risk of breakage and drill wander. Laser drilling overcomes these problems due to the fine laser beam focusing, equal to, or less than the hole diameter required. Additionally, it is a contactless process, preventing any breakages.
The challenges in laser drilling are many and include controlling the shape of the taper from entry to exit to achieve high aspects. This depends on controlling the focus as the beam moves through the surface of the material and becomes more difficult as the surface becomes thicker. It may also be necessary to drill thousands of holes with the a demand for smaller diameters, requiring smaller laser spot sizes. Other factors include beam shaping and careful selection of the laser wavelength, as well as ensuring that the motion system can provide precise placement and hole accuracy over a large area.