Wafer inspection, the science of finding defects in the starting wafer or substrate, or the finished device, is becoming more demanding, challenging, and costly due to the decreasing sizes of features and the complexity of the design. It is essential to analyze defects at each step throughout the manufacturing process since the inspection process becomes more challenging and costly when getting closer to the final device. Step-by-step scanning for defect inspection enables semiconductor manufacturers to prevent yield losses by detecting defects in an early stage, and thereby reducing costs.
Semiconductor processes and inspections rely heavily on precision motion and the ability to provide synchronized multi-axis dynamic performance with tight velocity regulation. PI offers several precision motion platforms tailored to address the high demands of process and inspection applications.